Prof. Dr. –Ing Hui-He QIU (LSTM Erlangen-Nuremberg, Germany)

Department of Mechanical Engineering

The Hong Kong University of Science & Technology

Clear Water Bay, Kowloon, Hong Kong

Email address: meqiu@ust.hk

Phone: (852) 2358 7190

Fax: (852) 2358 1543

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Research Area (研究领域):

1. The Thermal Contact Resistance on the Spreading and Solidification of a Droplet on a Substrate

Figure 1: Schematic of Experimental Setup

Figure 2: Evolution of heat flux (FH: Falling Height)

Figure 3: Evolution of thermal contact conductance (FH: Falling Height)

Figure 4: C_q-C_c relation (FH: Falling Height)

Figure 5: F vs. time when h_c=h_c(t,r)

Figure 6: T vs. time when h_c=h_c(t,r)

Figure 7: Schematic diagram of the experiment apparatus

Figure 8: Computer generated images compared with photographs of droplet deposited on the substrate

2. MODELING OF SUBSTRATE REMELTING, FLOW, AND RESOLIDIFICATION IN MICROCASTING

Figure 1: Schematic of the microcasting problem of interest: (a) initial condition (t=0); (b) computational domains

Figure 2: The maximum substrate melting front shape as function of time for case 2 (the shape is the superposition of envelope of the phase change front)

Figure 3: The comparison of substrate remelting from numerical simulations and the experiment: (a) Experiment results [3]; (b) Numerical results of case 1; (c) Numerical results of case 2; (d) Numerical results of case 3

Figure 4: The droplet height (measured at the centre) as a function of time for case 1, case 2 and case 3

Figure 5: The effect of impacting velocity on spreading factor and remelting volume

Figure 6: The effect of droplet superheat on spreading factor and remelting volume

Figure 7: The effect of substrate temperature on spreading factor and remelting volume