Ricky Lee received his BSc and MSc degrees from National Taiwan University and Virginia Polytechnic Institute & State University, respectively. In 1992, he graduated from Purdue University with a PhD degree in Aeronautical & Astronautical Engineering. After one year of post-doctoral research at Purdue, he joined the Hong Kong University of Science & Technology (HKUST). During his career of tenure-track faculty at HKUST, Dr Lee once was on secondment to serve as Chief Technology Officer of Nano & Advanced Materials Institute (NAMI) for two and a half years. Currently Dr Lee is Chair Professor of Mechanical and Aerospace Engineering and Director of Center for Advanced Microsystems Packaging (CAMP) at HKUST. He also has concurrent appointments as Associate Dean of Fok Ying Tung Graduate School, Director of HKUST Shenzhen Research Institute, General Manager of HKUST R and D Corporation (Shenzhen) Limited, and Director of HKUST LED-FPD Technology R&D Center at Foshan, Guangdong, China. Dr Lee has been focusing his research on the development of packaging and assembly technologies for electronics and optoelectronics. The topics of his R&D interests include wafer level packaging and 3D IC integration, through silicon vias (TSV) and high density interconnects, LED packaging for solid-state lighting, lead-free soldering and reliability analysis. The research outcomes of Dr Lee’s group have been documented in numerous technical papers in international journals and conference proceedings. He also co-authored 3 books and 9 book chapters. Due to his technical contributions, Dr Lee received many honors and awards over the years. In addition to being the recipient of 12 best/outstanding paper awards and 5 major professional society awards, Dr Lee is Fellow of IEEE, ASME, IMAPS, and Institute of Physics (UK). He is also an IEEE EPS Distinguished Lecturer.

Teaching Activities

MECH2030
MECH5925
Mechanisms & Dynamics of Machinery
LED Packaging Technology for Solid-State Lighting

 

Research Interests

Wafer-Level Packaging and 3D IC Integration
Through Silicon Vias (TSV) and High Density Interconnects
LED Packaging for Solid-State Lighting
Lead-free Soldering and Reliability Analysis