17 Jun 2020
Prof. Ricky Lee, Chair Professor of MAE Department, has been appointed to be the Editor of the ASME Journal of Electronic Packaging (JEP) starting from 1 July 2020 and the Chair of IEEE Fellows Evaluation Committee of Electronics Packaging Society (EPS) starting from 1 January 2021.
The ASME Journal of Electronic Packaging (JEP) is an international peer review journal exploring all aspects of microsystems, systems integration, flexible electronics, materials with nano structures. Prof. LEE is currently the Senior Associate Editor of ASME Journal of Electronic Packaging (JEP) and will become the Editor starting from 1 July 2020.
The IEEE Electronics Packaging Society (EPS) is the leading international forum for scientists and engineers engaged in the research, design and development of revolutionary advances in microsystems packaging and manufacturing. EPS is one of 38 technical Societies within the IEEE and it promotes close cooperation and exchange of technical information among members through technical conferences and workshops, peer-reviewed publications, and collaboration with other organizations. Prof. LEE is currently the committee member of the 2020 IEEE Fellows Evaluation Committee of EPS and will become the Chair of committee starting from 1 January 2021.
Congratulations to Prof. LEE!