24 Dec 2019
Our PhD graduate, Dr. Xiaowu Zhang, has been elevated to IEEE Fellow for contributions to three-dimensional integrated circuits, effective 1 January 2020.
Dr. Zhang received his Ph.D. degree in Mechanical Engineering (under supervised by Prof. Ricky Lee) from Hong Kong University of Science and Technology (HKUST), Hong Kong, in 1999. Currently, he is a senior scientist and a Principal Investigator (PI) at the Interconnection & Packaging Program, Institute of Microelectronics (IME), A*STAR, Singapore. He has authored or co-authored more than 200 technical papers in refereed journals and conference proceedings. He holds 13 patents too. One of his patents on micro-stress sensor has been licensed to a MNC two times.
IEEE is one of the world's largest techical professional organizations for the advancement of technology. IEEE Fellow is IEEE's highest honor which less than 0.1% of voting members are selected annually for this member grade elevation. And this is the first case of IEEE Fellow among our MAE alumni.
Congratulations to Dr. Xiaowu Zhang!