Department of Mechanical and Aerospace EngineeringOUR PEOPLE
David Chuen-Chun LAM 林銓振
PhD, University of Califonia at Santa Barbara
Professor of Mechanical and Aerospace Engineering



Prof David CC Lam is a material scientist who teaches mechanical engineering design, manufacturing and material processing at the Hong Kong University of Science and Technology (HKUST). He conducts basic research in nanocomposite and nanoporous material processing and development with applications in electronics packaging. He is applying the basic research results in the development of printed electronic fabrication technologies, ultralow-k dielectric materials and using them in wireless applications in toys, in motion sensors and in RFID. The group is also developing sensor-integrated microneedle systems that will allow sensing of body chemistry and transdermal delivery of large molecular drug.

Teaching Activities

MECH3520 Design and Manufacturing II

 

Research Interests

Development of new materials and processes for use in wireless applications Development of smart drug delivery system
 

Research Projects

  • Characterization and modeling of viscoelastic strain gradient effects in small-scaled structures for sensors and microelectronic devices Characterization and modeling of strain gradient stiffened nanocomposite.
  • Research and development of statistical process-reliability relations on multilayerd flexible substrates. Development of climbing inspection robot.

 

Selected Publications

Journal Papers

  • J. Wang and D.C.C. Lam, “nanostiffening in Nanocomposites,” International J. Sold. Structure (accepted 2010).
  • W-L Ko, S.Y.Y Leung, D.C.C. Lam, and C. Leung, “Development of in vivo method for characterization of the elastic properties of the cornea,” Investigative Opthal. Vis. Sci., (accepted, 2010).
  • M-K. Mui and D.C.C. LAM, “Design-process modeling of meso-accelerometers,” IEEE Transactions on Electronics Packaging Manufacturing (Accepted 2009).
  • J. Wang and D.C.C. LAM, “Model and analysis of size-stiffening in nanoporous cellular solids,” J. Mater. Sci. Vol 44 (2009) pp.985-991.
  • D. Qiao, G.K.H. Pang, M-K Mui and D.C.C. LAM, “A Single-Axis Low-Cost Accelerometer Fabricated Using Printed-Circuit-Board Techniques,” IEEE Electron Device Letters, (2009) 30 1293 - 1295
  • J. Wang, Y-X. Ren and D.C.C. LAM, “Couple stress model of steric stiffening in nanoporous solids,” Advanced Materials Research Vols. 47-50 (2008) 730-733.
  • K.T. Shek and D.C.C. LAM, “insertion behavior of microneedles for drug delivery,” Advanced Materials Research Vols. 47-50 (2008) pp 1442-1445.
  • Y-X Ren and D.C.C. Lam, “Properties and microstructures of low-temperature-processable ultra-low-dielectric porous polyimide films,” J. Electronic Mater. Vol. 37, No 7 2008 955-961.
  • S. Y. Y. Leung and D. C. C. Lam, "Geometric and Compaction Dependence of Printed Polymer-Based RFID Tag Antenna Performance," IEEE Transactions on Electronics Packaging Manufacturing, VOL. 31, NO. 2, APRIL 2008 120-125.
  • P. L. CHENG, S. Y. Y. LEUNG, T. W. LAW, C. K. LIU, I. T. CHONG and D. C. C. LAM, “Quantitative Analysis of Resistance Variations in Nickel-Phosphorus (NiP) Resistors,” IEEE Transactions on Components and Packaging Technologies, Col 30 No. 2 264-268 (2007).
  • P. L. CHENG ,C.K. LIU,T. W. LAW,I. T. CHONG, D. C. C. LAM, S. Y. Y. LEUNG, “Quantitative Analysis of Resistance Tolerance of Polymer Thick Film Printed Resistors,” IEEE Transactions on Components and Packaging Technologies Vol. 30 No. 2  269-274 (2007).
  • S. Y. Y. Leung and D. C. C. Lam , “Performance of printed polymer based RFID antenna on curvilinear surface,” IEEE CPMT Transactions in Electronic Packaging Manufacturing, vol 30 200-205 (2007)
  • D.C.C. Lam, J. Wang and F. Yang, “Hygrothermal failures from small defects in lead-free solder reflowed electronics packages,” Adv. Pack. IEEE Trans. Vol 30, (2007) 636-640
  • D.C.C. Lam and J. Wang, “Hygrothermal delaminations in Lead-free solder reflow of electronic packages,” J. Electr. Mater. Vol 36 (2007) 226-231.
  • Y-X Ren and D.C.C. Lam, “Characterization of elastic behaviors of silicon nitride thin films with varying thicknesses,” MSE-A, 467 (2007) 93-96.
  • DCC LAM, J  Wang and F Yang, “Steam-Driven Delamination Failures in Lead-Free
  • Solder Reflow I: Small Defects,” IEEE Transactions on Components and Packaging Technologies (accepted, in press)

Conference Papers

  • J. Wang and D.C.C. Lam, “nanostiffening in nanocomposites,”,ICCES’10 Las Vegas, March 2010.
  • J-L Dai,S.Y.Y. Leung, O. Dong, W. Wei, D.C.C. Lam, “Investigation of freeze drying process on stabilization of mouse immunoglobulin G,”6th International School and Symposium on Medical Devices and Biosensors (MDBS 2009) Shenzhen, China, Dec 2009.
  • VINCENT LI, KK LAU, S.K. LI, LAWRENCE LEE, CHRISTINE CHOW, DAVID CC LAM, “BEYOND OUTCOME-BASED: COMPETITION-BASED LEARNING FOR ENGINEERING STUDENTS,”9th International Conference on Modern Industrial Training; Nanjing, China, April,2009.
  • J. Wang and D.C.C. Lam, “Determination of higher order material properties from nanoindentation data using FEM,”,ICCES’09 Phuket Thailand, April 2009.
  • D. Qiao, G.K.H. Pang, M.K, Mui, D.C.C. LAM, “A New PCB-based low-cost accelerometer for human motion sensing,” Proceedings of the IEEE International Conference on Automation and logistics, Qingdao, China Sept. 2008.
  • L.H. Keung, D.C.C. Lam and P. Tong, “Theory and experiments in strain gradient viscoelasticity,” ICCES 07
  • S. Y. Y. Leung and D. C. C. Lam, "Geometric and Compaction Dependence of Printed Polymer-Based RFID Tag Antenna Performance," in International Conference on Electronic Materials and Packaging Daejeon, Korea, 2007
  • S. Y. Y. Leung and D. C. C. Lam, "Parametric Analysis and Design of Ultra Fine Assembly of Micro Dies," in International Conference on Electronic Materials and Packaging, Daejeon, Korea, Nov. 2007. pp. 1-6.
  • Y-X Ren, and D.C.C. Lam, “Low Temperature Processable Ultra-Low Dielectric Porous Polyimide for High Frequency Applications,” EMAP 2006
  • M.K. Mui and D.C.C. Lam, “Development and characterization of low cost accelerometer,” EMAP 2006
  • S. Y. Y. Leung and D. C. C. Lam , “Printed polymer based RFID antenna on curvilinear surface,” International Conference on Electronic Materials and Packaging, Dec. 2006 pp.1 - 6


 

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