Department of Mechanical and Aerospace EngineeringOUR PEOPLE
Matthew Ming-Fai YUEN 袁銘輝
PhD, Bristol
Professor Emeritus of Mechanical and Aerospace Engineering

Professor Yuen graduated from the University of Hong Kong with a 1st Class Honours in Mechanical Engineering and obtained his Ph.D. in Mechanical Engineering from Bristol University. He worked for GEC and Babcock & Wilcox in UK before returning to Hong Kong to lecture at the University of Hong Kong. He joined The Hong Kong University of Science and Technology (HKUST) as one of the founding members of the Department of Mechanical Engineering in 1992. He had served as the Associate Dean of Engineering, the founding Director of the CAD/CAM Facility and the founding Director of the EPACK Laboratory at HKUST. He was also the Director of the Technology Transfer Center at HKUST and Vice President of the HKUST R&D Corporation for the period 1998-2007. Professor Yuen was the Acting Vice-President of Research and Development, and President and CEO of HKUST R&D Corporation for the period 2009-2010. He is currently the Head of Department of Mechanical Engineering. Professor Matthew Yuen has a wide range of experience, in particular in the promotion of innovation and entrepreneurship. He is currently chairing the Board of Examiners of the Hong Kong Management Association Quality Award. He also serves on the Board of two Hong Kong listed companies as Independent Non-Executive Director. He is advising two start-up companies in Hong Kong and one in Silicon Valley.

Research Interests


  • Featured-based modeling
  • Soft Object modeling
  • Collaborative Product Development
  • Precision machine and system design

Electronic Packaging:

  • Interfacial delamination
  • Thermal interface materials
  • Printed electronics
  • Molecular modeling

Research Projects

  • CAD system kernel development
  • Soft object modeling and sketch-based design
  • Molecular modeling and material design (SAM structure for adhesion, thermal interface materials, printed electronics materials, conductive polymer composite)
  • Precision molding system
  • Precision machine design

Selected Publications


  • Chen, M., Chen, X.Y., Tang, K., Yuen MMF, “Efficient Boolean operation on manifold mesh surfaces”, 2010, Computer-Aided Design and Applications 7 (3), pp. 405-415
  • Liu, Y.-J., Lai, K.-L., Dai, G., Yuen MMF, “A semantic feature model in concurrent engineering”, 2010, IEEE Transactions on Automation Science and Engineering, 7 (3), art. no. 5439907, pp. 659-665
  • Liu, Y.-J., Zhang, D.-L., Yuen MMF, “A survey on CAD methods in 3D garment design”, 2010, Computers in Industry Volume 61 Issue 6, August, 2010
  • Liu, Y.-J., Yuen, M.M.F. “Geometry-optimized virtual human head and its applications”, 2008, Computers and Graphics, 32 (6), pp. 624-631
  • Wang, Yu; Wang, Charlie Changling and Yuen MMF., (2006) "Fast energy-based surface wrinkle modeling", Computers and Graphics, 30 (1), pp. 111-125. 

Electronic Packaging:

  • Yang, C., Yuen MMF, Gao, B., Ma, Y., Wong, C.P., “Investigation of a biocompatible polyurethane-based isotropically conductive adhesive for UHF RFID tag antennas”, 2011, Journal of Electronic Materials 40 (1), pp. 78-84
  • Yang, C., Xie, Y.-T., Yuen MMF, Xiong, X., Wong, C.P., “A facile chemical approach for preparing a SERS active silver substrate”, 2010, Physical Chemistry Chemical Physics 12 (43), pp. 14459-14461
  • Fan, H.B., Yuen MMF, “A multi-scale approach for investigation of interfacial delamination in electronic packages”, 2010, Microelectronics Reliability 50 (7), pp. 893-899
  • Yang, C., Xie, Y.-T., Yuen MMF, Xu, B., Gao, B., Xiong, X., Wong, C.P., “Silver surface iodination for enhancing the conductivity of conductive composites”, 2010, Advanced Functional Materials 20 (16), pp. 2580-2587
  • Liu, C., Fan, H.-B., Zhang, K., Yuen MMF, Li, Z., “Flow dependence of interfacial thermal resistance in nanochannels”, 2010, Journal of Chemical Physics, 132 (9), art. no. 094703
  • Yang, C., Tang, Y.H., Lam, W.M., Lu, W.W., Gao, P., Zhao, C.B., Yuen MMF, “Moisture-cured elastomeric transparent UV and X-ray shielding organic-inorganic hybrids”, 2010, Journal of Materials Science, 45 (13), pp. 3588-3594
  • Fan, H.-B., Zhang, K., Yuen, M.M.F. “The interfacial thermal conductance between a vertical single-wall carbon nanotube and a silicon substrate”, 2009, Journal of Applied Physics 106 (3), art. no. 034307
  • Wong, C.K.Y., Yuen, M.M.F., Xu, B., “Thiol-based self-assembly nanostructures in promoting interfacial adhesion for copper-epoxy joint”, 2009, Applied Physics Letters 94 (26), art. no. 263102
  • Wong, C.K.Y., Yuen, M.M.F., “Thiol based chemical treatment as adhesion promoter for Cu-epoxy interface”, 2008, IEEE Transactions on Components and Packaging Technologies 31 (2 SPEC. ISS.), pp. 297-308
  • Zhang, K., Chai, Y., Yuen, M.M.F., Xiao, D.G.W., Chan, P.C.H., “Carbon nanotube thermal interface material for high-brightness light-emitting-diode cooling”, 2008, Nanotechnology 19 (21), art. no. 215706
  • Chai, Y., Gong, J., Zhang, K., Chan, P.C.H., Yuen, M.M.F., “Flexible transfer of aligned carbon nanotube films for integration at lower temperature “, 2007, Nanotechnology 18 (35), art. no. 355709
  • Fan HB, Chan EKL ,Wong CKY ,Yuen MMF, “Molecular dynamics simulation of thermal cycling test in electronic packaging “, 2007, Journal of Electronic Packaging, Transactions of the ASME 129 (1), pp. 35-40
  • Fan, H.B., Yuen MMF. "Material properties of the cross-linked epoxy resin compound predicted by molecular dynamics simulation", 2007, Polymer, 48 (7), pp. 2174-2178.
  • Zhang, K., Yuen MMF, Gao, J.H., Xu, B. "Fabrication of High Thermal Conductivity Carbon Nanotube Arrays by Self Assembled Fe3O4 particles", 2007, CIRP Annals - Manufacturing Technology, 56 (1), pp. 245-248.
  • Fan, H.B., Chan E.K.L., Wong, C.K.Y., Yuen MMF. "Investigation of moisture diffusion in electronic packages by molecular dynamics simulation", 2006, Journal of Adhesion Science and Technology, 20 (16), pp. 1937-1947.
  • Fan, H.B., Wong, C.K.Y., Yuen MMF.., “A multi-scale method to investigate delamination in electronic packages”, 2006, Journal of Adhesion Science and Technology, 20 (10), pp. 1061-1078.
  • Wong, C.K.Y., Gu, H., Xu, B., Yuen MMF., “A new approach in measuring Cu-EMC adhesion strength by AFM”, 2006, IEEE Transactions on Components and Packaging Technologies 29 (3), pp. 543-550
  • Gong, J.-F., Chan, P.C.H., Xiao, G.-W., Lee, R.S.W., Yuen MMF.. “A reliability comparison of electroplated and stencil printed flip-chip solder bumps based on UBM related intermetallic compound growth properties”, (2006) IEEE Transactions on Components and Packaging Technologies, 29 (1), pp. 164-172.
Email meymf