Department of Mechanical and Aerospace EngineeringOUR PEOPLE
Shi-Wei Ricky LEE ζŽδΈ–η‘‹
PhD, Purdue
Chair Professor of Mechanical and Aerospace Engineering
Director of Center for Advanced Microsystems Packaging
Director of HKUST LED-FPD Technology R&D Center at Foshan

Ricky Lee received his BSc and MSc degrees from National Taiwan University and Virginia Polytechnic Institute & State University, respectively. In 1992, he graduated from Purdue University with a PhD degree in Aeronautical & Astronautical Engineering. After one year of post-doctoral research at Purdue, he joined the Hong Kong University of Science & Technology (HKUST). During his career of tenure-track faculty at HKUST, Dr Lee once was on secondment to serve as Chief Technology Officer of Nano & Advanced Materials Institute (NAMI) for two and a half years. Currently Dr Lee is Professor of Mechanical Engineering and Director of Center for Advanced Microsystems Packaging (CAMP) at HKUST. He also has a concurrent appointment as Director of HKUST LED-FPD Technology R&D Center at Foshan, Guangdong, China. Dr Lee has been focusing his research on the development of packaging and assembly technologies for electronics and optoelectronics. The topics of his R&D interests include wafer level packaging and 3D IC integration, through silicon vias (TSV) and high density interconnects, LED packaging for solid-state lighting, lead-free soldering and reliability analysis. The research outcomes of Dr Lee’s group have been documented in numerous technical papers in international journals and conference proceedings. He also co-authored three books and nine book chapters. Due to his technical contributions, Dr Lee received many honors and awards over the years. In addition to being the recipient of nine best/outstanding paper awards and three major professional society awards, Dr Lee is Fellow of IEEE, ASME, and Institute of Physics (UK). He is also an IEEE CPMT Distinguished Lecturer and has been invited to give workshops and short courses worldwide. Furthermore, Dr Lee was elected the President of IEEE CPMT Society in 2011 and is serving for the term of 2012-2013.

Teaching Activities

Mechanisms & Dynamics of Machinery                                           
LED Packaging Technology for Solid-State Lighting               

Research Interests

Wafer-Level Packaging and 3D IC Integration
Through Silicon Vias (TSV) and High Density Interconnects
LED Packaging for Solid-State Lighting
Lead-free Soldering and Reliability Analysis

Selected Publications

Refereed Journals

  •  Zhang, R., Lo, J. C. C., Lee, S. W. R. (2012) “Design and Fabrication of a Silicon Interposer with TSVs in Cavities for 3D IC Packaging,” IEEE Transactions on Device & Materials Reliability. (accepted)
  • Zhang, R., Lee, S. W. R. (2012) “Moldless Encapsulation for LED Wafer Level Packaging using Integrated DRIE Trenches,” Microelectronics Reliability, Vol. 52, pp. 922-932.
  • Lau, J. H., Zhang, M., Lee, S. W. R. (2011) “Embedded 3D Hybrid IC Integration System-in-Package with Through-Silicon Vias for Opto-Electronic Interconnects in Organic Substrates/Printed Circuit Boards,” Journal of Electronic Packaging, ASME Transactions, Vol. 133, Issue 3, 031010, pp.1-7.
  • Chen, C. H., Zhang, S. X., Lee, S. W. R., Mohamed, L. (2011) “Investigation on Copper Diffusion Depth in Copper Wire Bonding,” Microelectronics Reliability, Vol. 51, No. 1, pp. 166-170.
  • Chan, Y. S., Lee, S. W. R. (2011) “Spacing Optimization of High Power LED Arrays for Solid State Lighting,” Journal of Semiconductors, Vol. 32, No. 1, pp. 014005-1-5.

Conference Proceedings

  • Tang, K., Song, F., Lee, S. W. R. (2012) “Comparative Study on Dendrite Formation on Solder Pads with ImAg and OSP Surface Finishes Using Water Drop Test Method,” Proc. 12th International Conference on Electronics Packaging (ICEP), Tokyo, Japan, 17-20 April, pp. 274-279.
  • Zhang, R., Lo, J. C. C., Chen, K., Lee, S. W. R., Lai, Y. S., Tsai, T. Y. (2011) “Multi-Chip LED Wafer Level Packaging with Through-Silicon Slots for Interconnection,” Proc. 8th China International Forum on Solid State Lighting (ChinaSSL), Guangzhou, China, 8-10 November, pp. 208-214.
  • Wu, H., Lee, S. W. R. (2011) “Study on Copper Plating Solutions for Fast Filling of Through Silicon Via (TSV) in 3D Electronic Packaging,” Proc. International Microsystems, Packaging, Assembly & Circuits Technology Conference (IMPACT), Taipei, Taiwan, 18-21 October, pp. 343-346.
  • Zhang, R., Lee, S. W. R., Xiao, D. G., Chen, H. (2011) “LED Packaging using Silicon Substrate with Cavities for Phosphor Printing and Copper-filled TSVs for 3D Interconnection,” Proc. 61st  Electronic Components & Technology Conference (ECTC), Orlando, FL, 31 May-3 June, pp. 1616-1621.
  • Yang, C., Song, F., Lee, S. W. R. (2011) “Investigation of PWB Laminate Resin and Its Relation with the Pad Cratering Resistance,” Proc. 11th International Conference on Electronics Packaging (ICEP), Nara, Japan, 13-15 April, pp. 177-182.


Tel +852 2358 7203
Fax +852 2358 1543
Email Ricky Lee
Office Room 2577