Department of Mechanical and Aerospace EngineeringOUR PEOPLE
Yun Yuen Stanley LEUNG  梁潤園
MPhil, PhD, HKUST
BSc, UCLA
Teaching Associate of Mechanical and Aerospace Engineering



Dr. Leung graduated from the University of California, Los Angeles in Chemical Engineering in 1995.  He obtained his Master’s and Doctoral degrees from the Hong Kong University of Science and Technology, majoring in Mechanical Engineering, in 2001 and 2008 respectively.  He has extensive experiences in manufacturing process design, development, and qualification of biomedical and optoelectronics devices, and as the inventor of 50+ patents.

He has a strong international perspective with education and working experiences in Hong Kong, the Netherlands, and China.  He has worked in the State Key Laboratory of Solid State Lighting in China, the Delft University of Technology in the Netherlands, and the Hong Kong University of Science and Technology.  He was a key project leader of National 863 program, the International S&T Cooperation Program of China and several joint development projects with industries from China, Germany and Japan. He was also a researcher participate in the European Union's Research and Innovation funding programme, the Hong Kong Innovation and Technology Fund Research Projects.

Teaching Activities

MECH2520
MECH3830
 

Research Interests

Biomedical applications, multi-discipline mechanisms and testing design, Optoelectronic packaging and novel materials applications.
 

Selected publications 

Book Chapter
  • Cell KY Wong, Stanley Y. Y. Leung, RH Poelma, KMB Jansen, CCA Yuan, WD van Driel, GQ Zhang, “Establishment of the Mesoscale Parameters for Separation: A Nonequilibrium Molecular Dynamics Model” in Molecular Modeling and Multiscaling Issues for Electronic Material Applications, pp. 133-148. Springer International Publishing, 2015.

Refereed Journal
  • X.P. Chen, Q.H. Liang, J.K. Jiang, Cell K.Y. Wong, Stanley Y.Y. Leung, H.Y. Ye, D.G. Yang, and T.L. Ren, “Functionalization-induced changes in the molecular structure of amorphous polyaniline: a first-principles and molecular dynamics study,” Nature Scientific Reports 6, 2016.
  • X.P. Chen, N. Yang, J.M. Ni, M. Cai, H.Y Ye, Cell K.Y. Wong, Stanley Y. Y. Leung, and T.L. Ren, “Density-Functional Calculation of Methane Adsorption on Graphenes,” IEEE Electron Device Letters, vol. 36, 2015.
  • Y Liu, Stanley Y. Y. Leung, J Zhao, CKY Wong, CA Yuan, G Zhang, F Sun, L Luo, “Thermal and mechanical effects of voids within flip chip soldering in LED packages,” Microelectronics Reliability, vol. 54, pp. 2028-2033, 2014
  • Xianping Chen, Cadmus A. Yuan, Cell K.Y. Wong, Huaiyu Ye, Stanley Y.Y. Leung, Guoqi Zhang, “Molecular modeling of protonic acid doping of emeraldine base polyaniline for chemical sensors," Sensors and Actuators B: Chemical, vol. 174, pp. 210-216, 2012.
  • Cell K. Y. Wong, Stanley Y. Y. Leung, Rene H. Poelma, Kaspar M. B. Jansen, Cadmus C. A. Yuan, Willem D. van Driel, and Guoqi Zhang, “Establishment of the coarse grained parameters for epoxy-copper interfacial separation," Journal of Applied Physics, vol. 111, 2012.
  • C. K. Y. Wong, Stanley Y. Y. Leung, Haibo Fan and M. M. F. Yuen, “Synergistic Toughening of Epoxy–Copper Interface Using a Thiol-Based Coupling Layer," Journal of Adhesion Science and Technology, vol. 25, pp. 2081-2099, 2011. 
  • Stanley Y. Y. Leung and D. C. C. Lam, “Geometric and Compaction Dependence of Printed Polymer-Based RFID Tag Antenna Performance”, IEEE Transactions on Electronics Packaging Manufacturing, vol. 31, pp. 120-125, 2008.
  • Stanley Y. Y. Leung and D. C. C. Lam, “Performance of printed polymer-based RFID antenna on curvilinear surface,” IEEE Transactions on Electronics Packaging Manufacturing, vol. 30, pp. 200-205, 2007.
  • P. L. Cheng, Stanley Y. Y. Leung, T. W. Law, C. K. Liu, J. I. T. Chong, and D. C. C. Lam, “Quantitative analysis of resistance tolerance of polymer thick film printed resistors,” IEEE Transactions on Components and Packaging Technologies, vol. 30, pp. 269-274, 2007.
  • P. L. Cheng, Stanley Y. Y. Leung, T. W. Law, C. K. Liu, J. I. T. Chong, and D. C. C. Lam, “Quantitative analysis of resistance variations in nickel-phosphorus (NiP) resistors,” IEEE Transactions on Components and Packaging Technologies, vol. 30, pp. 264-268, 2007.
  • Stanley Y. Y. Leung, D. C. C. Lam, S. Luo, and C. P. Wong, “The role of water in delamination in electronic packages: degradation of interfacial adhesion,” Journal of Adhesion Science and Technology, vol. 18, pp. 1103-1121, 2004

Conference paper
  • Shu Hao LU, Guo Zhen Chen, Stanley Y.Y. Leung, and D. C. C. Lam, "Development of Ocular Viscosity Characterization Method," in International Conference of the IEEE Engineering in Medicine and Biology Society, Florida, USA, 2016.
  • CKY Wong, GQ Fan, Stanley Y. Y. Leung, CCA Yuan, GQ Zhang, “The new generation package free LED: The performance and reliability of white chip” in 11th China International Forum on Solid State Lighting (SSLCHINA), 2014, pp. 114-119
  • H Tang, Y Yu, M Jia, Stanley Y. Y. Leung, C Qian, CCA Yuan, X Zhou, GQ Zhang, “Effect of material creeping on the reliability of thermal interface of LED spotlight module” in 11th China International Forum on Solid State Lighting (SSLCHINA), 2014, pp. 120-124
  • Y Xiong, Y Yu, H Kang, Stanley Y. Y. Leung, X Zhou, GQ Zhang, “270 degree half intensity angle LED retrofit light bulb based on planar light source coupling with reflective structure” in 11th China International Forum on Solid State Lighting (SSLCHINA), 2014, pp. 84-87
  • J. Zhao, Y. Liu, H. Tang, Stanley Y. Y. Leung, C. C. A. Yuan, and G. Q. Zhang, "A novel design of heatsink-less LED base fluorescent lamp retrofit," 15th International Conference on Electronic Packaging Technology (ICEPT), 2014, pp. 1202-1207.
  • H. Tang, Y. Yu, M. Jia, Stanley Y. Y. Leung, C. Qian, C. C. A. Yuan, and G. Q. Zhang, "Influences of viscoelasticity of polybutylene terephthalate (PBT) on the thermal interface contact of LED spotlight module," in 15th International Conference on Electronic Packaging Technology (ICEPT), 2014, pp. 1198-1201.
  • C. K. Y. Wong, Stanley Y. Y. Leung, Y. J. Xiong, C. C. A. Yuan, and G. Q. Zhang, "A model in predicting color of LED packages with different phosphor layer dimensions," in 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2014.
  • H. Tang, J. Zhao, B. Li, Stanley Y. Y. Leung, C. C. A. Yuan, and G. Q. Zhang, "Thermal performance of embedded heat pipe in high power density LED streetlight module," in 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2014, pp. 1-6.
  • Stanley Y. Y. Leung, Lei Zhong, Jia Wei, Zhenlei Xu, Cadmus C A Yuan and G Q Zhang, “Optical design and characterization of micro-fabricated light reflector for 3D multi-chip LED module,” in  Proceedings of International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro/Nanoelectronics and Systems, Poland, 2013.
  • Cell K.Y. Wong, Stanley Y. Y. Leung, Lin Niu, Gongqi Fan, Xiang Zhou, Cadmus C.A. Yuan, Guoqi Zhang, Yanglin Li, Menglong Tu and Shaofang Wang, “Color Consistence Improvement in LED packages,” in International Conference on Electronic Materials and Packaging Hong Kong SAR, China, 2012.
  • Stanley Y. Y. Leung, M. Sadeghinia, H. Pape and L. J. Ernst, “Prediction of Mixed-Mode Interfacial Fracture from Cohesive Zone Finite Element Model: Testing and Determination of Fracture Process Parameters” in Proceedings of International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro/Nanoelectronics and Systems, Austria, 2011 [Keynote Presentation]
  • C. K. Y. WONG, Stanley Y. Y. Leung, R.H. Poelma, K.M.B. Jansen, C. C. A. Yuan, W. D. van Driel, G. Q. Zhang, “Molecular Dynamics study of the traction-displacement relations of epoxy-copper interfaces” in Proceedings of International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro/Nanoelectronics and Systems, Austria, 2011
  • Stanley Y. Y. Leung and D. C. C. Lam, “Parametric Analysis and Design of Ultra Fine Assembly of Micro Dies,” in International Conference on Electronic Materials and Packaging, Daejeon, Korea, 2007.
  • Stanley Y. Y. Leung and D. C. C. Lam, “Geometric and Compaction Dependence of Printed Polymer-Based RFID Tag Antenna Performance,” in International Conference on Electronic Materials and Packaging Daejeon, Korea, 2007.
  • Stanley Y. Y. Leung, P. K. Tiu, and D. C. C. Lam, “Printed polymer based RFID antenna on curvilinear surface,” in International Conference on Electronic Materials and Packaging Hong Kong SAR, China, 2006.
  • C. K. Liu, P. L. Cheng, Stanley Y. Y. Leung, and D. C. C. Lam, “Inductance tolerance analyses and design-process map of embedded planar spiral inductor,” in Proceedings - Electronic Components and Technology Conference, Las Vegas, NV, 2004, pp. 1108-1112.
  • C. K. Liu, P. L. Cheng, Stanley Y. Y. Leung, T. W. Law, and D. C. C. Lam, “Development of High Permeability Core Materials for Embeddable Inductors in Flexible Organic Substrates,” in Flexible Electronics-- Materials and Devices Technology as held at the MRS Spring Meeting, 2003, pp. 343-348.
  • P. L. Cheng, Stanley Y. Y. Leung, T. W. Law et al., “Quantitative analysis of resistance variations in as-deposited nickel-phosphorus (NiP) embedded resistors,” in Proceedings - Electronic Components and Technology Conference, New Orleans, LA, USA, 2003, pp. 156-160.
  • Stanley Y. Y. Leung, D. C. C. Lam, and C. P. Wong, “Experimental investigation of time dependent degradation of coupling agent bonded interfaces,” in Proceedings - Electronic Components and Technology Conference, Orlando, FL, USA, 2001, pp. 1333-1337.
  • Stanley Y. Y. Leung, S. J. Luo, D. C. C. Lam, and C. P. Wong, “Influence of chemistry and applied stress on reliability of polymer and substrate interfaces,” in Proceedings - Electronic Components and Technology Conference, Las Vegas, NV, USA, 2000, pp. 581-585.
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