MAE/ ECE/ I2MS JOINT SEMINAR
Recent Progress in MEMS and Flexible Sensors – from Wearable to Implantable Applications
Prof. Chengkuo Lee
Department of Electrical and Computer Eng., National University of Singapore (NUS), Singapore
||15 Mar 2017 (Wed)
||11: 00 a.m.
(This is a MECH6090L PG Seminar.)
Wearable and implantable electronics and sensors comprising silicon and polymer based materials have opened up new range of research activities. These intelligent wearable electronics with diverse sensing modules can simultaneously differentiate among various physical stimuli from the complex external environment, including strain, twist, temperature, and humidity. Implanted biomedical devices currently become popular because they are considered as the viable solution to realize implanted prostheses for novel applications such as human-machine interface and electroceuticals. For example, these flexible electrodes and sensors placed within the peripheral nervous system, the nerves that work throughout our arms and legs. Selective sciatic nerve recording and stimulation are investigated using flexible electrodes with minimal pressure on the nerve, but still provided a good electrical contact with the nerve. Other flexible devices, including physiological signal sensing, energy harvesting and nanomedicine delivery are also developed as novel approaches to further understand disease mechanisms and to explore electroceuticals.
However, one of the critical challenges for long-term use of such devices is a reliable power source with sound output power. To support the operation of such wearable and implanted devices, diversified energy harvesting mechanisms have been developed using piezoelectric, electromagnetic, thermoelectric and triboelectric approaches. In NUS, we have worked with various teams and explored the energy harvesting technology for wearable and implantable applications. With the strong demands from IoT and industry 4.0 applications, we developed the self-powered sensors as well. In this talk, I will highlighted our technology and activities at CISM, SINAPSE and HiFES center, NUS.
Chengkuo Lee received the M.S. degree in materials science and engineering from National Tsing Ha University, Hsinchu, Taiwan, in 1991; the M.S. degree in industrial and system engineering from Rutgers University, New Brunswick, NJ, USA, in 1993; and the Ph.D. degree in precision engineering from the University of Tokyo, Tokyo, Japan, in 1996. He was a Foreign Researcher with the Nanometer Scale Manufacturing Science Laboratory, Research Center for Advanced Science and Technology, University of Tokyo, from 1993 to 1996. He was with the Mechanical Engineering Laboratory, AIST, MITI, Tsukuba, Japan, as a JST Research Fellow, in 1996. Thereafter, he became a Senior Research Staff Member with the Microsystems Laboratory, Industrial Technology Research Institute, Hsinchu. In 1997, he joined Metrodyne Microsystem Corporation, Hsinchu, and established the MEMS Device Division and the first micromachining fab for commercial purposes in Taiwan. He was the Manager of the MEMS Device Division from 1997 to 2000. He was an Adjunct Assistant Professor with the Electrophysics Department, National Chiao Tung University, Hsinchu, in 1998, and the Institute of Precision Engineering, National Chung Hsing University, Taichung, Taiwan, from 2001 to 2005. In 2001, he co-founded Asia Pacific Microsystems, Inc., where he first became the Vice President of Research and Development before becoming as the Vice President of the Optical Communication Business Unit and a Special Assistant to the Chief Executive Officer in charge of international business and technical marketing for the microelectromechanical systems (MEMS) foundry service. From 2006 to 2009, he was a Senior Member of the Technical Staff with the Institute of Microelectronics, A-STAR, Singapore. He is currently an Associate Professor with the Department of Electrical and Computer Engineering, and the director of center for intelligent sensors and MEMS (CISM), National University of Singapore, Singapore. He is Executive Editor Board of J Micromechanics and Microeng. (IOP, UK), Editor of Scientific Reports, and Associate editor of Journal of Micro/Nanolithography, MEMS and MOEMS (JM3; SPIE). He has co-authored the books Advanced MEMS Packaging (McGraw-Hill, 2010), Micro and Nano Energy Harvesting Technologies (Artech House, 2014). He has contributed to more than 280 international conference papers and extended abstracts, and 220 peer-reviewed international journal articles in the fields of sensors, actuators, energy harvesting, MEMS, NEMS, nanophotonics, and nanotechnology. He holds nine U.S. patents.